Liquid Based (MJCA)
Description of the Product:
If you are in need of a liquid base cooling solution MJCA might be the solution you are looking for. MJCA offers increase packing option verses traditional cold plates. This options include utilizing non-electrically conductive materials of construction including: Diamond, and BeO. This allows electrolytes to be used as the coolant without having to add insulting material to the heat sink when the heat source is in electrical contact with the cold plate or heat sink. In addition, utilizing BeO or diamond allows for reduced thermal expansion coefficient mismatch which can lead to bonding failure between the chip and the cold plate. Since the MJCA achieves its high heat transfer coefficients even when impinging on flat surfaces, the back side of the diamond or BeO do not need complex shapes to achieve the high heat transfer rate which reduces the cost of construction.
If a wet interface is possible than the total thermal resistance can be reduced by having the MJCA impinge directly on the chip.
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