Liquid Based (MJCA)
Description of the Product:
If you are in need of a liquid based cooling solution, MJCA may be the solution you are looking for. MJCA offers more packing options than traditional cold plates. One option is to use non-electrically conductive materials of construction including: Diamond, and BeO. This allows electrolytes to be used as coolant, without having to add insulting material to the heat sink when the heat source is in electrical contact with the cold plate or heat sink. In addition, utilizing BeO or diamond allows for reduced thermal expansion coefficient mismatch which can lead to bonding failure between the chip and the cold plate. Since the MJCA achieves its high heat transfer coefficients even when impinging on flat surfaces, the back side of the diamond or Be do not need complex shapes to achieve the high heat transfer rate. This reduces the cost of construction.
If a wet interface is possible, then the total thermal resistance can be reduced by having the MJCA impinge directly on the chip.
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