PRODUCTS Summary of Electronic Cooling Electronic thermal management consists of directly removing heat from the electronic component and transferring it to a fluid.  The most common electronic thermal management component is a heat sink, which is typically mounted on the back of micro-processors to help the micro-processor dump heat into the local environment.  Advances in the performance of electronic components are associated with a significant increase in the amount of waste heat that must be removed.  Existing cooling devices can not meet the demands of the most difficult cooling requirements today, and will not meet the majority of cooling requirement of tomorrow’s electronic devices.  Therefore Mezzo has developed two new liquid cooling technologies to address the growing challenges of electronic and optronic cooling.  1) Micro-jet cooling arrays (MJCA) 2) Micro-channel cold plates.